Solar Photovoltaic Wafer Processing Solutions Machines

KGK International can provide the equipment you need for higher yields and increased productivity of solar wafer processing.

We offer the service of slicing both mono and multi-crystalline silicon ingots into wafers for silicon wafers for multiple applications and have been leading the industry with new technologies. Today, major companies rely on our ability to produce ultra thin slices with a yield of more than 90%.

KGK is the distributor for TSKK equipment. TSKK was founded in 1961 and developed ingot slicing and grinding machines and have since become one of the leading manufacturers in the industry. They have developed a Triple-Tasking cylindrical grinder with the ability to dice, grind and surface finish all at one station. TSKK has also designed a slicing machine to simultaneously cut both sides of multi-crystal silicon.

We also represent Yasunaga, which is one of the foremost manufacturers of wire saws in the world. With the use of smaller diameter wire and a higher processing speed, higher yields can be achieved. Yasunaga also developed a slurry recycler that reduces both consumable cost and environmental waste by effectively reclaiming used slurry.

Call or e-mail Tom Donnowitz at 847-465-4415 or tdonnowitz@kgki.com for more information.